Wire bonder

Bonder: TPT HB05

A wire bonder makes very small contact to the sample by wedging the wire into the contact and using ultrasonic welding for attaching it. The machine in University of Turku is fully manual allowing for different materials and sample sizes. The sample can be heated to enhance bonding.

For more information, contact Hannu Huhtinen.

Specifications:

  • Wedge bonder
  • 40 µm Al or Au wire

For more information, contact Hannu Huhtinen.